| WAFER SAWING |
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| DICING SERVICE FOR WAFERS |
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| Materials |
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Aluminium oxide |
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Aluminium nitride |
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Ceramics |
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Glass |
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Silicon |
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Other material on request |
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| Wafer dimensions |
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max. 6 |
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| Wafer thickness |
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min. 190 µm |
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max. 400 µm |
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| Dicing channel |
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silicon: min. 75 µm |
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other: min. 100 µm |
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| Tape |
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standard blue tape |
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| Delivery form |
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on tape with 6” frame |
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REMARKS
The dicing channel should be free of metallisation. It is not possible to saw the wafer in proper form if electroplated metallization with a thickness above 1 µm exists in the dicing channel. |
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